3D Memory Chips May Beat 3D Hybrid Memory Cube

Novati Technologies Inc., a Tezzaron Semiconductor subsidiary, will demonstrate a three-dimensional memory and integrated sensor system-in-package at SEMICON Europa 2015 in Dresden. The platform stacks 20-micron thinned die, combining memory, logic, MEMS and sensors into a package the size of a conventional planar chip.

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Skorpios Expands Its Presence in New Mexico

Skorpios Technologies will acquire a manufacturing facility in Albuquerque to expand research, development, testing and assembly, creating up to 300 jobs. The company will receive $5.5 million from state LEDA funding and $1.5 million from the city. Skorpios plans volume production of its QSFP28-CWDM 100G transceiver in 2016.

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Novati’s Integrated Sensor Platform Brings It all Together

Novati Technologies announced an integrated sensor platform built at its Austin fabrication center, Novati Technologies. The platform pairs 3D IC wafer stacking and sensor module assembly to target Internet of Things applications. The release follows Tezzaron’s eight-layer 3D IC wafer stack, also produced at Novati’s Austin facility.

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