3D sensing is increasingly seen as necessary in diverse areas ranging from smart cities, robotics, food delivery and agriculture to drones, autonomous cars and automotive safety.  The use of active techniques like LiDAR is gaining prominence.  Skorpios’ Tru-SiPh™ platform enables truly chip-scale LiDAR in which all sub-systems like transmit, receive and scanning can be implemented on a single CMOS chip, built in our own vertically integrated semiconductor facilities.  Our IP and expertise in integration of high performance, III-V devices into silicon CMOS wafers enables eye-safe, high performance, coherent LiDAR that provides precise 3D information of the environment at high range, frame rates and resolution without the use of any moving parts to scan the Field-of-View (FoV).  Our solutions offer customer low SWaP (Size, Weight and {Power) systems which are semiconductor scalable and low cost, and can operate in harsh environments.  Vertical integration of design and manufacturing capabilities offers significant customer advantages in terms of customization and platform integration.