A novel three-dimensional (3D) memory from the self-described “nanotechnology development center” with its own fab to boot will make an appearance next week at SEMICON Europa 2015. Novati Technologies Inc. (Austin, Texas)—a wholly owned subsidiary of Tezzaron Semiconductor—will show its latest foray into 3D chips that combine memory, logic, microelectromechanical systems (MEMS) and other sensors/actuators into one system-in-package (SiP) Integrated Sensor Platform for the Internet of Things (IoT). The SiPs, which stack 20-micron thinned die into a package the same size as a traditional planar chip, will be shown at SEMICON Europa 2015 (Oct. 6-8, Dresden, Germany). Read the full article here.