Wafer Scale Manufacturing
The Tru-SiPh™ platform was built from the ground up to disrupt the traditional photonics markets in multiple applications. Tru-SiPh™ is being designed into ethernet pluggable modules, into copackaged optics, into Lidar, and into biosensor applications. Using our own high volume silicon foundry, we have developed a proprietary process for embedding III-V compounds within our silicon wafers, providing a high-performance wafer scale platform with all the advantages of traditional InP based optics, but without the discrete construction and alignments which are typically used. Our proprietary technology provides unique temperature insensitive optics allowing uncooled use in most applications.
With embedded lasers, modulators and photodiodes, the architecture is extremely compact compared to other approaches and contains all necessary elements for any optical function. Resulting products are natively hermetically sealed and require no additional packaging. By bonding thin eitaxies directly to the silicon substrate, our structures outperform traditional InP based optics for thermal performance resulting in very compact long-lived active elements. Serving all applications in O- and C- band, with a variety of components (see toolbox below), the platform was designed from the ground up to be application agnostic.
What is in our tool box of Tru-SiPh™ components?
Single frequency long cavity external DBR lasers in C- and O-bands
Full C-band or O-band tunable lasers with narrow linewidth <70kHz)
controllable to <10pm
Electroabsorbtion modulators with <1.5V
p-p drive voltage
InP based Mach Zender modulators with a fraction the size of silicon MZ modulators
High bandwidth, high efficiency
Short cavity monitor photodiodes
Tuning free mux and demux for O- and C- band
Couplers and splitters
Polarization control elements, splitters
Low loss waveguides with 5um bend radii
Spot size converters for simplified coupling to fiber
Optical phased array for free space transmission
Skorpios to Show 1.6Tb/s Tru-SiPh™ Technology at OFC 2023
Skorpios SKRP 6031 1.6T Optical IC transmitting two channels of 800Gbps data San Diego, CA –…
Skorpios to Demonstrate 3.2 Tb/s Co-Packaged Optics at OFC
3.2Tb/s Transceiver HPICs Integrates All Necessary Opto-Electronic Functionality to Transmit and Receive 32 Channels of 100G PAM-4…
Skorpios Tru-SiPh™ Heterogenous Integrated Photonic ICs Demonstrated in LuxshareTech 800G Optical Transceivers at OFC
The Skorpios Tru-SiPh™ Technology Provides A Cost-Effective, Highly Integrated, and Reliable Transmitter to Power 8-Channel, 100G PAM-4…
Skorpios Technologies, Inc. Today Announces the Relocation of Its Semiconductor Wafer Fabrication Operation to Southern California
New Facility Offers Expansion and Access to Talent Austin, Texas – March 2, 2023 – Skorpios Technologies,…
Skorpios Technologies and ColorChip Group Announce Strategic Partnership to Produce Optical Modules
Combining Skorpios’ Tru-SiPh™ Technology and ColorChip Volume Manufacturing Expertise. San Diego, California. – March 8, 2022 –…
Skorpios’ fully integrated optical functionality greatly simplifies our manufacturing and reduces our costs with known good die. Our long experience building modules with integrated photonic platforms reaches its ultimate with Skorpios’ product. We believe that Skorpios’ Silicon Photonics technology combined with our multi-million unit annual capacity will help the industry to enable single mode transceiver pricing at 50 cents per gigabit for 200G, 400G and beyond.
Yigal EzraCEO of ColorChip
Skorpios’ fully integrated optical functionality greatly simplifies our manufacturing and reduces our costs. We’ve been working with Skorpios perfecting the photonic module design and technology for our customers since early 2021.