Wafer Scale Manufacturing
The Tru-SiPh™ platform was built from the ground up to disrupt the traditional photonics markets in multiple applications. Tru-SiPh™ is being designed into ethernet pluggable modules, into copackaged optics, into Lidar, and into biosensor applications. Using our own high volume silicon foundry, we have developed a proprietary process for embedding III-V compounds within our silicon wafers, providing a high-performance wafer scale platform with all the advantages of traditional InP based optics, but without the discrete construction and alignments which are typically used. Our proprietary technology provides unique temperature insensitive optics allowing uncooled use in most applications.
Architecture
With embedded lasers, modulators and photodiodes, the architecture is extremely compact compared to other approaches and contains all necessary elements for any optical function. Resulting products are natively hermetically sealed and require no additional packaging. By bonding thin eitaxies directly to the silicon substrate, our structures outperform traditional InP based optics for thermal performance resulting in very compact long-lived active elements. Serving all applications in O- and C- band, with a variety of components (see toolbox below), the platform was designed from the ground up to be application agnostic.
Optical Toolbox
What is in our tool box of Tru-SiPh™ components?
Lasers
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Single frequency long cavity external DBR lasers in C- and O-bands
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Full C-band or O-band tunable lasers with narrow linewidth <70kHz)
controllable to <10pm
Modulators
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Electroabsorbtion modulators with <1.5V
p-p drive voltage -
InP based Mach Zender modulators with a fraction the size of silicon MZ modulators
Photodiodes
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High bandwidth, high efficiency
end-coupled photodiodes -
Short cavity monitor photodiodes
Optical elements
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Tuning free mux and demux for O- and C- band
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Gratings
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Couplers and splitters
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Polarization control elements, splitters
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Low loss waveguides with 5um bend radii
Light coupling
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Spot size converters for simplified coupling to fiber
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Optical phased array for free space transmission
Latest News
Skorpios Technologies Hosts Congressman Darrell Issa
Skorpios Technologies hosted Congressman Darrell Issa at its Temecula, California semiconductor facility, including a tour of a 450,000 sq ft plant with over 50,000 sq ft of class 100 cleanroom. Company executives discussed domestic manufacturing, hiring plans, and sample availability for heterogeneously integrated silicon photonics chips up to 1.6Tbps.
Skorpios Technologies Providing Tours of Its New Fab with Wine Tasting at OFC
Skorpios Technologies will host tours of its new 450,000-square-foot Temecula facility during OFC24, followed by wine tasting. The company described Tru‑SiPh HPICs and expanded manufacturing capacity for silicon photonics and silicon nanostructures serving AI, biomedical, advanced packaging, and military applications. Tours can be booked via the company link.
Skorpios Technologies Announces Closing of Additional Funding to Complete Relocation to Temecula, California
Skorpios Technologies closed a financing round to complete relocation to a 450,000-square-foot fab in Temecula, California. The capital will support restart of operations and development of Tru-SiPh heterogeneous photonic integrated circuits, including work on 1.6Tb/s HPICs for silicon photonics and silicon nanostructure markets.
Skorpios Technologies Announces Reopening of Services in New Fab Facility in Temecula California
Skorpios Technologies reopened a 450,000 sq ft fab in Temecula, California under a 15-year lease with two 10-year extension options. The facility resumes wafer processing for Tru-SiPh heterogeneous photonic integrated circuits and 200mm/300mm foundry services, including <65nm lithography, patterned and blanket test wafers, 2.5D/3D packaging, copper RDL and metrology.
Skorpios 1.6Tb/s Tru-SiPh™ Technology Demonstration
Skorpios Technologies published a video demonstrating its Tru-SiPh HPIC operating at 200 Gbps per lane and 1.6 Tb/s aggregate on a single module. The demonstration includes hardware setup, test methodology, and reported link performance aimed at data-center and high-performance computing interconnect use cases.