3D Memory Chips May Beat 3D Hybrid Memory Cube

A novel three-dimensional (3D) memory from the self-described “nanotechnology development center” with its own fab to boot will make an appearance next week at SEMICON Europa 2015. Novati Technologies Inc. (Austin, Texas)—a wholly owned subsidiary of Tezzaron Semiconductor—will show its latest foray into 3D chips that combine memory, logic, microelectromechanical systems (MEMS) and other sensors/actuators into one system-in-package (SiP) Integrated Sensor Platform for the Internet of Things (IoT). The SiPs, which stack 20-micron thinned die into a package the same size as a traditional planar chip, will be shown at SEMICON Europa 2015 (Oct. 6-8, Dresden, Germany). Read the full article here.

Novati Technologies Selects Applied Materials to Create Advanced 200mm Line

Since the company’s inception in 2012, Novati Technologies has achieved tremendous growth, establishing itself as the go-to fab provider for “More than Moore” applications – including 3D and heterogeneous architectures, as well as advanced materials to enable new sensor and circuit functionality. Read the full press release here.