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Skorpios Technologies Hosts Congressman Darrell Issa
Skorpios Technologies hosted Congressman Darrell Issa at its Temecula, California semiconductor facility, including a tour of a 450,000 sq ft plant with over 50,000 sq ft of class 100 cleanroom. Company executives discussed domestic manufacturing, hiring plans, and sample availability for heterogeneously integrated silicon photonics chips up to 1.6Tbps.
Read MoreSkorpios Technologies Providing Tours of Its New Fab with Wine Tasting at OFC
Skorpios Technologies will host tours of its new 450,000-square-foot Temecula facility during OFC24, followed by wine tasting. The company described Tru‑SiPh HPICs and expanded manufacturing capacity for silicon photonics and silicon nanostructures serving AI, biomedical, advanced packaging, and military applications. Tours can be booked via the company link.
Read MoreSkorpios Technologies Announces Closing of Additional Funding to Complete Relocation to Temecula, California
Skorpios Technologies closed a financing round to complete relocation to a 450,000-square-foot fab in Temecula, California. The capital will support restart of operations and development of Tru-SiPh heterogeneous photonic integrated circuits, including work on 1.6Tb/s HPICs for silicon photonics and silicon nanostructure markets.
Read MoreSkorpios Technologies Announces Reopening of Services in New Fab Facility in Temecula California
Skorpios Technologies reopened a 450,000 sq ft fab in Temecula, California under a 15-year lease with two 10-year extension options. The facility resumes wafer processing for Tru-SiPh heterogeneous photonic integrated circuits and 200mm/300mm foundry services, including <65nm lithography, patterned and blanket test wafers, 2.5D/3D packaging, copper RDL and metrology.
Read MoreSkorpios 1.6Tb/s Tru-SiPh™ Technology Demonstration
Skorpios Technologies published a video demonstrating its Tru-SiPh HPIC operating at 200 Gbps per lane and 1.6 Tb/s aggregate on a single module. The demonstration includes hardware setup, test methodology, and reported link performance aimed at data-center and high-performance computing interconnect use cases.
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