CPO

Skorpios products for copackaging optical interfaces on high speed switch or processor chips are here. 3.2Tb/s will be sampling in the 2nd quarter. Our initial approach uses a 3.2Tb/s optical chip with associated electrical devices to provide FR4 interfaces on high-speed digital devices.

Skorpios Product Family Skorpios Part Numbers Product Description Features Status Information pdfs
CPOSKRP9101Skorpios 3.2T CPO HPIC3.2T HPIC for CPO Application; 100G per Lane, Compact Size (18mm x 9mm) Including 4 Blocks of Tru-SiPhTM 800G 2xFR4 TX & RX with Spare Lasers, SOAs, Tuning-Free Muxes/DeMuxes, and 1x16 SSC Array Integrated; High Power Efficiency, Long MTTF, Low Thermal Impedance; Flip ChipSamplingyes
SKRP9201Skorpios 6.4T CPO HPIC6.4T HPIC for CPO Application; 200G per Lane, Compact Size (18mm x 9mm) Including 4 Blocks of Tru-SiPhTM 1.6T 2xFR4 TX & RX with Spare Lasers, SOAs, Tuning-Free Muxes/DeMuxes, and 1x16 SSC Array Integrated; High Power Efficiency, Long MTTF, Low Thermal Impedance; Flip ChipPlanningyes
SKRP9501Skorpios 3.2T CPO Optical Engine3.2T Optical Engine for 51.2T CPO System Application; 100G per Lane, Compact Size (~20mm x ~25mm) Including Tru-SiPhTM 3.2T CPO HPIC, High Speed ICs, Control ASICs, and Fiber Ribbon Integrated; High Power Efficiency, Long MTTF, Low Thermal Impedance; LGA Electrical Connections, MPO Optical ConnectionsSamplingyes
SKRP9601Skorpios 6.4T CPO Optical Engine6.4T Optical Engine for 102.4T CPO System Application; 200G per Lane, Compact Size (~20mm x ~25mm) Including Tru-SiPhTM 6.4T CPO HPIC, High Speed ICs, Control ASICs, and Fiber Ribbon Integrated; High Power Efficiency, Long MTTF, Low Thermal Impedance; LGA Electrical Connections, MPO Optical ConnectionsPlanningyes
Evaluation KitSKRPEK003Skorpios 3.2T CPO HPIC Evaluation KitEvaluation Kit for Tru-SiPhTM 1.6T CPO HPIC, Electrical and Optical Connections ReadySamplingno