Skorpios Technologies to Demonstrate 400G CWDM8 Transceiver at ECOC 2019

DUBLIN and ALBUQUERQUE, N.M.Sept. 23, 2019 — Skorpios Technologies, Inc., an integrated silicon photonics company, today announced it is demonstrating its 400G CWDM8 transceiver product at ECOC 2019 in Dublin. In addition, it is providing an update on its 100G CWDM4 QSFP28 product and unveiling the company’s new product roadmap which includes FR4/FR8 and ZR products.

The 400G CWDM8 transceiver further demonstrates the disruptive nature of Skorpios’ heterogenous photonic integrated circuit (HPIC) technology platform:

  • Integration: Demonstrates the world’s first heterogeneously integrated (III-V and Silicon) 400G Tx device with 8 lasers, 8 modulators, in a 3x5mm package
  • Scalability: The Tx device has two lasers implemented on each of 4 pieces of III-V material, demonstrating how the HPIC technology platform can easily scale to massively higher bandwidths
  • Bandwidth and Performance: Skorpios’ HPIC III-V EAM modulators are capable of 50G NRZ and PAM4 based optical transmissions using the same architecture and are easily upgradeable to 100G per wavelength
  • Platform Flexibility: Proves Skorpios has the technology platform capable of delivering highly integrated optical engines and modules to the market, including 400G CWDM8, 400G FR4, 400G ZR and more

Skorpios continues to make significant progress with its 100G CWDM4 QSFP28 module. The company has completed over 2,000 hours of successful reliability testing and is in system qualification with Tier 1 switch vendors. Skorpios is accepting purchase orders for its 100G product at differentiated pricing enabled by its unique technology platform.

Skorpios also provided an update to its new product roadmap which features 400G FR4, 800G FR4x2, 800G FR8, 400ZR and 800ZR products. The company plans to ship 400G FR4 modules in Q1 2020 and sample 800G FR8 modules in Q4 2020.

“Our 400G demo and shipment of our 100G product underscore the power, scalability and disruptive nature of Skorpios’ HIPIC technology platform,” said James Czilli, vice president of engineering.

Skorpios Technologies Announces Acquisition of Novati Technologies LLC


ALBUQUERQUE, N.M. – Skorpios Technologies, Inc., a System on Chip (SoC) company, today announced that it has acquired Novati Technologies LLC, a semiconductor integration company and fab located in Austin, TX. The acquisition closed on Oct. 2, 2017 for an undisclosed amount. The combined corporation will be called Skorpios Technologies. Read the full story here.

Novati to Showcase Positive Results of Hybrid Bonding at IEEE International Interconnect Technology Conference

May 16, 2017 07:00 AM Eastern Daylight Time

Austin, TX – Novati Technologies, LLC, a semiconductor development and commercialization company, will present their poster, “Reliability of Hybrid Bond Interconnects,” at the 2017 IEEE International Interconnect Technology Conference in Hsinchu, Taiwan on May 16-18. 3D integration dramatically improves device performance, and hybrid bonding is gaining traction as an advantageous technology for building 3D integrated circuits.

This poster demonstrates the positive results of hybrid bonding at the wafer-level in a reliability study conducted in collaboration with ON Semiconductor [and subsequently published in a white paper under the same title]. The study evaluates and characterizes test structures formed with hybrid bonding techniques, specifically oxide-to-oxide bonds and copper-to-copper bonds. Read the full release here.

Novati Technologies Focuses on Diverse Applications

Much of today’s leading-edge semiconductor development is being done, not by using the most advanced design rules, but by integrating disparate chips to meet system-level performance goals. Often done in the vertical dimension, this heterogeneous integration is now among the core competencies of Austin, Texas-based Novati Technologies, a relatively small company with outsized importance in the 3D development field.

In a sense Novati, which operates in a facility that was the original Sematech research fab, is a continuation of the Sematech legacy of developing new technologies. While Sematech was a research consortium that shared its R&D with its member companies, Novati works with individual customers on development and low-volume manufacturing, and closely guards its customers’ intellectual property. Read the full article here.

Orbotech’s SPTS Technologies Collaborates with Novati Technologies to Establish New Plasma Dicing Line

SPTS Technologies, an Orbotech company and a supplier of advanced wafer-processing solutions for the global semiconductor and related industries, today announced its collaboration with Novati Technologies, a leading global nanotechnology development center, to establish Novati’s new plasma dicing line at their state-of-the-art fab in Austin, Texas. Novati has selected SPTS’s Rapier-300S plasma dicing solution over competing options to provide next-generation plasma dicing capabilities and services for customers. Read the full press release here.

Novati Technologies Focuses on Diverse Applications

Nanochip Vol11/Issue2/2016

Much of today’s leading-edge semiconductor development is being done, not by using the most advanced design rules, but by integrating disparate chips to meet system-level performance goals. Often done in the vertical dimension, this heterogeneous integration is now among the core competencies of Austin, Texasbased Novati Technologies, a relatively small company with outsized importance in the 3D development field. Read more.

Skorpios Technologies Announces Brian R. Griffiths as Chief Financial Officer

ALBUQUERQUE, N.M. – September 6, 2016 – /PRNewswire/ – Skorpios Technologies, Inc., a fabless integrated silicon photonics system on a chip company, today announced the addition of Brian R. Griffiths as chief financial officer, effective immediately. In his new role at Skorpios, Griffiths will oversee the finance, accounting, M&A and investor relations’ functions, reporting to CEO Stephen Krasulick.

Griffiths is a veteran investment banker and advisor to the technology sector. During his 25-year investment banking career, he has worked on capital-raising and strategic transactions with many of the leading technology companies globally. Most recently, Griffiths was a senior managing director at Guggenheim Partners, working with companies across the technology industry. Prior to that, he was a managing director at Credit Suisse in New York and London. Griffiths earned an M.S. in Accounting from New York University and an M.B.A. from the Amos Tuck School at Dartmouth College.

“We are very pleased to welcome Brian to the team,” said Krasulick. “Brian’s strong financial and strategic experience, combined with deep technology sector expertise and global perspective, will be a tremendous asset to Skorpios as we embark on the next phase of our company’s evolution.”

“I am very excited to join Steve and the Skorpios team,” Griffiths added. “The market opportunity enabled by the technology platform that Skorpios has developed is very large and Skorpios has demonstrated clear technology leadership. I look forward to playing a key role in supporting Steve as we lead the business forward to its goal of being an independent, publicly-traded company.”

About Skorpios Technologies
Skorpios is a fabless semiconductor company delivering highly integrated communications products based upon its proprietary, wafer-scale, silicon photonics process. This novel process leverages the existing silicon manufacturing ecosystem to enable high bandwidth interconnectivity at mature CMOS manufacturing costs. Skorpios’ unique platform can be used to address a wide range of applications: high-speed video, data and voice communications for networking and cloud computing, storage, wireless and cable TV. For more information, visit

Press Contact:
Alfredo Viglienzoni

3D Memory Chips May Beat 3D Hybrid Memory Cube

A novel three-dimensional (3D) memory from the self-described “nanotechnology development center” with its own fab to boot will make an appearance next week at SEMICON Europa 2015. Novati Technologies Inc. (Austin, Texas)—a wholly owned subsidiary of Tezzaron Semiconductor—will show its latest foray into 3D chips that combine memory, logic, microelectromechanical systems (MEMS) and other sensors/actuators into one system-in-package (SiP) Integrated Sensor Platform for the Internet of Things (IoT). The SiPs, which stack 20-micron thinned die into a package the same size as a traditional planar chip, will be shown at SEMICON Europa 2015 (Oct. 6-8, Dresden, Germany). Read the full article here.

Novati Technologies Selects Applied Materials to Create Advanced 200mm Line

Since the company’s inception in 2012, Novati Technologies has achieved tremendous growth, establishing itself as the go-to fab provider for “More than Moore” applications – including 3D and heterogeneous architectures, as well as advanced materials to enable new sensor and circuit functionality. Read the full press release here.

Skorpios Expands Its Presence in New Mexico