Skorpios Technologies Announces Acquisition of Novati Technologies LLC

 

ALBUQUERQUE, N.M. – Skorpios Technologies, Inc., a System on Chip (SoC) company, today announced that it has acquired Novati Technologies LLC, a semiconductor integration company and fab located in Austin, TX. The acquisition closed on Oct. 2, 2017 for an undisclosed amount. The combined corporation will be called Skorpios Technologies. Read the full story here.

Novati to Showcase Positive Results of Hybrid Bonding at IEEE International Interconnect Technology Conference

May 16, 2017 07:00 AM Eastern Daylight Time

Austin, TX – Novati Technologies, LLC, a semiconductor development and commercialization company, will present their poster, “Reliability of Hybrid Bond Interconnects,” at the 2017 IEEE International Interconnect Technology Conference in Hsinchu, Taiwan on May 16-18. 3D integration dramatically improves device performance, and hybrid bonding is gaining traction as an advantageous technology for building 3D integrated circuits.

This poster demonstrates the positive results of hybrid bonding at the wafer-level in a reliability study conducted in collaboration with ON Semiconductor [and subsequently published in a white paper under the same title]. The study evaluates and characterizes test structures formed with hybrid bonding techniques, specifically oxide-to-oxide bonds and copper-to-copper bonds. Read the full release here.

Novati Technologies Focuses on Diverse Applications

Much of today’s leading-edge semiconductor development is being done, not by using the most advanced design rules, but by integrating disparate chips to meet system-level performance goals. Often done in the vertical dimension, this heterogeneous integration is now among the core competencies of Austin, Texas-based Novati Technologies, a relatively small company with outsized importance in the 3D development field.

In a sense Novati, which operates in a facility that was the original Sematech research fab, is a continuation of the Sematech legacy of developing new technologies. While Sematech was a research consortium that shared its R&D with its member companies, Novati works with individual customers on development and low-volume manufacturing, and closely guards its customers’ intellectual property. Read the full article here.

Orbotech’s SPTS Technologies Collaborates with Novati Technologies to Establish New Plasma Dicing Line

SPTS Technologies, an Orbotech company and a supplier of advanced wafer-processing solutions for the global semiconductor and related industries, today announced its collaboration with Novati Technologies, a leading global nanotechnology development center, to establish Novati’s new plasma dicing line at their state-of-the-art fab in Austin, Texas. Novati has selected SPTS’s Rapier-300S plasma dicing solution over competing options to provide next-generation plasma dicing capabilities and services for customers. Read the full press release here.

Novati Technologies Focuses on Diverse Applications

Nanochip Vol11/Issue2/2016

Much of today’s leading-edge semiconductor development is being done, not by using the most advanced design rules, but by integrating disparate chips to meet system-level performance goals. Often done in the vertical dimension, this heterogeneous integration is now among the core competencies of Austin, Texasbased Novati Technologies, a relatively small company with outsized importance in the 3D development field. Read more.

Skorpios Technologies Announces Brian R. Griffiths as Chief Financial Officer

ALBUQUERQUE, N.M. – September 6, 2016 – /PRNewswire/ – Skorpios Technologies, Inc., a fabless integrated silicon photonics system on a chip company, today announced the addition of Brian R. Griffiths as chief financial officer, effective immediately. In his new role at Skorpios, Griffiths will oversee the finance, accounting, M&A and investor relations’ functions, reporting to CEO Stephen Krasulick.

Griffiths is a veteran investment banker and advisor to the technology sector. During his 25-year investment banking career, he has worked on capital-raising and strategic transactions with many of the leading technology companies globally. Most recently, Griffiths was a senior managing director at Guggenheim Partners, working with companies across the technology industry. Prior to that, he was a managing director at Credit Suisse in New York and London. Griffiths earned an M.S. in Accounting from New York University and an M.B.A. from the Amos Tuck School at Dartmouth College.

“We are very pleased to welcome Brian to the team,” said Krasulick. “Brian’s strong financial and strategic experience, combined with deep technology sector expertise and global perspective, will be a tremendous asset to Skorpios as we embark on the next phase of our company’s evolution.”

“I am very excited to join Steve and the Skorpios team,” Griffiths added. “The market opportunity enabled by the technology platform that Skorpios has developed is very large and Skorpios has demonstrated clear technology leadership. I look forward to playing a key role in supporting Steve as we lead the business forward to its goal of being an independent, publicly-traded company.”

About Skorpios Technologies
Skorpios is a fabless semiconductor company delivering highly integrated communications products based upon its proprietary, wafer-scale, silicon photonics process. This novel process leverages the existing silicon manufacturing ecosystem to enable high bandwidth interconnectivity at mature CMOS manufacturing costs. Skorpios’ unique platform can be used to address a wide range of applications: high-speed video, data and voice communications for networking and cloud computing, storage, wireless and cable TV. For more information, visit www.skorpiosinc.com.

Press Contact:
Alfredo Viglienzoni
alfredo_viglienzoni@skorpiosinc.com
1-505-369-1542

3D Memory Chips May Beat 3D Hybrid Memory Cube

A novel three-dimensional (3D) memory from the self-described “nanotechnology development center” with its own fab to boot will make an appearance next week at SEMICON Europa 2015. Novati Technologies Inc. (Austin, Texas)—a wholly owned subsidiary of Tezzaron Semiconductor—will show its latest foray into 3D chips that combine memory, logic, microelectromechanical systems (MEMS) and other sensors/actuators into one system-in-package (SiP) Integrated Sensor Platform for the Internet of Things (IoT). The SiPs, which stack 20-micron thinned die into a package the same size as a traditional planar chip, will be shown at SEMICON Europa 2015 (Oct. 6-8, Dresden, Germany). Read the full article here.

Novati Technologies Selects Applied Materials to Create Advanced 200mm Line

Since the company’s inception in 2012, Novati Technologies has achieved tremendous growth, establishing itself as the go-to fab provider for “More than Moore” applications – including 3D and heterogeneous architectures, as well as advanced materials to enable new sensor and circuit functionality. Read the full press release here.

Skorpios Expands Its Presence in New Mexico

Novati’s Integrated Sensor Platform Brings It all Together

A few weeks ago, Tezzaron announced its latest industry first: an eight-layer 3D IC wafer stack containing active logic, built at its fab, Novati Technologies, a global nanotechnology development center located in Austin, TX. Novati is clearly on a roll, because today they added another industry first to their product portfolio: an integrated sensor platform that is the culmination of everything Novati does: using all the building blocks in its technology arsenal to create new and unique sensor modules to enable the Internet of Things. Read the full article here.