Tool List

Novati Technologies: Tool List by Process Area

Lithography
CapabilityToolWafer Size
Spin On Dielectric & Other Material CoatingTEL ACT 8 SOD SYSTEM
TEL ACT 12 SOD SYSTEM
200 – 300mm
193 nm Lithography > 80 nm L/S resolution, OL < 30 nmASML XT1100/500 (NAmax 0.75) + FSI POLARIS 2500 TRACK200 – 300mm
193 nm Lithography > 100 nm hole resolution, OL < 30 nmASML XT1100/500 (NAmax 0.75) + FSI POLARIS 2500 TRACK200 – 300mm
248 nm Lithography > 180 nm L/S resolution, OL < 60nmMicroscan 3 (NAmax 0.6) + DNS 80B TRACK200mm
248 nm Lithography > 220 nm hole resolution OL < 60nmMicroscan 3 (NAmax 0.6) + DNS 80B TRACK200mm
i-line Lithography > 350 nm L/S resolution OL < 100nm Canon 5500 iZa (NAmax 0.57) + DNS 80B TRACK200 – 300mm
i-line Lithography > 400 nm hole resolution OL < 100nmCanon 5500 iZa (NAmax 0.57) + DNS 80B TRACK200 – 300mm
Proximity Print > 1uSuss Microtech MA8 + Suss Microtech ACS200 Track200mm
Dry Plasma Etch & Strip
CapabilityToolWafer Size
Front End Resist Ash, (1) CH. – O2/CF4Axcelus Fusion Asher 200MCU200mm
Dielectric Etch: Oxide, Nitride, BARCAMAT P5000/MxP+ Chamber200mm
Silicon Etch: silicon, aSi, polySiAMAT P5000/MxP Chamber200mm
Dielectric Etch: SiO2, SiN, BARCLRC TCP 9400PTX/9100 chamber200mm
Poly Etch: PolySi, aSi, SiLRC TCP 9400PTX/9400FM chamber200mm
Dielectric Etch: Oxide, Nitride, BARCAMAT Super E Chamber200mm
Deep Silicon EtchAMAT DPS DT+200mm
Metal Gate Etch: DPS IIAMAT Centura DPSII 200mm
Novel Metal Etch: DPS II/ High TempAMAT Centura DPSII High Temp200mm
Tungsten (W) Etch: ClampedLRC Rainbow 4728 Tungsten200mm
Metal Plasma Etch: AlCu/Ti/TiN/TiW etc.LRC Research 9600 TCP200mm
Deep Silicon EtchSTPS Rapier200 – 300mm
Barrel AsherBranson IPC4000200mm
Backend Resist Ash (2 chambers)
ULVAC Enviro200mm
DRM Oxide Etch: Oxide EtchTEL Unity II E200mm
DRM Oxide Etch: Low-K Etch
TEL Unity II E200mm
Poly, Si Trench and Metals
AMAT Centura DPSII300mm
Etch Oxide, and nitride etch for trench and contacts (Front end) AMAT Centura E-max300mm
Silicon Bosch TSV Etch
SPTS Rapier Chamber
300mm
Front and back end asher w O2/ CF4/NH3Axcellis (Matrix) Jaguar 300300mm
Oxide Trench and Via etch and ASH, > 100nm DR
TEL Telius DRM O/P “T-305D”300mm
High Aspect Ration Quartz and Oxide EtchSPTS Synapse Chamber200mm
Plasma Dicing EtchSPTS Rapier Chamber200 – 300mm
Low K Trench and Via etch and ASH, > 100nm DR
TEL Telius SCCM “T-305D”300mm
Diffusion, CVD & RTP
CapabilityToolWafer Size
Atmospheric Undoped SiO2 Steam/Dry/Anneal BTU/BRUCE Horizonal Furnace200mm
Atmospheric Doped Oxide BTU/BRUCE Horizonal Furnace200mm
Atmospheric Undoped oxide: Steam or Dry Ox & Anneal SVG-THERMCO Vertical Furnace: Steam/Dry200mm
Low Pressure Chem. Vapor Deposition – AmorSI & POLY Si
SVG-THERMCO Vertical Furnace: LPCVD Poly/Amor200mm
Low Pressure Chem. Vapor Deposition – TEOS SVG-THERMCO Vertical Furnace: LPCVD TEOS200mm
Low Pressure Chem. Vapor Deposition – Silicon NitrideSVG-THERMCO Vertical Furnace: LPCVD Silicon Nitride200mm
Atmospheric Rapid Thermal Anneal (N2/O2)AG Associates AG8800200mm
Atmospheric Rapid Thermal Processing (Spike Anneal)Mattson 5000+200mm
Atmospheric FG or N2 An. Cu onlyBTU/BRUCE Horizonal Furnace200mm
Metal Anneal and Low K Cure. 4% max H2 in N2. Atmospheric or VacuumTEL a-8SE-E Vertical Furnace200mm
Atm Stm/Dry/Anneal Undoped – Atmo/Low Pressure
TEL – Vertical furnace oxidation ALPHA 303H300mm
LPCVD Amor. Si and Poly SI (530c and 600C)TEL – Vertical furnace 303-H LPCVD POLY/AMOR300mm
Cu Anneal – 250c – 450cTEL – Vertical furnace ALPHA 303I-H300mm
Low K anneal – 535c – 620cTEL – Vertical furnace ALPHA 303H300mm
Wet Etch/Clean
CapabilityToolWafer Size
SPM, SC1, SC2, Dilute HF for oxide etch, KOHFSI Mercury Spray Processor 2 200mm
Vapor HF Oxide EtchFSI Excalibur200mm
Pre-gate cleans, SPM, 200:1HF oxide etch, SC1, SC2, O3 rinseDNS Wet Etch FC82-IL200mm
Backend Post ash cleans, Post Al etch polymer cleansSCP Global Technologies 8400200mm
Engineering Wet Deck – 2 tanksSCP Global Technologies 9100200mm
Hot H3PO4 for SiN etch, Hot KOHSCP Global Technologies 8400200mm
Backside Clean (CU)SEZ 203 Spray Acid Cleans200mm
WET STRIP-METAL/POLY/SiSEZ Spin Etcher 303300mm
Backside Cu decontamination and Via CleansSEZ 303L 300mm
Thin Films
CapabilityToolWafer Size
ALD HfO2, HfSiO2, HfZrOx, ZrO2, ZrSiO2Vesta Atomic Layer Deposition – Dielectric ALD200 -300mm
ALD HfN, HfON, HfSiN, HfSiON, ZrN, ZrSiN, ZrON, ZrSiONVesta Atomic Layer Deposition – Dielectric ALD200 -300mm
ALD Al2O3,SiO2,Ta2O5, H2O-(Al2O3,HfO2,HfSiO2, or Ta2O5)Vesta Atomic Layer Deposition – Dielectric ALD200 -300mm
ALD Thermal/Plasma anneal (H2, NH3, O2, N2O)Vesta Atomic Layer Deposition – Dielectric ALD200 -300mm
ALD TiN, TaCN, SiNVesta Atomic Layer Deposition – Metal ALD200 -300mm
ALD Soft-Sputter etch, Insitu Ti-TiN liner depositionVesta Atomic Layer Deposition – Metal ALD200 -300mm
PVD Metal Gate & Bias Sput’d Diel.: (Ti, Ta, W, etc.)Anelva C-7100MeGa – Target acquitsition as req’d – 5 targets200 -300mm
PVD React. Sput’d Metal & Diel.: (TiN, TaN, TiOx, etc)Anelva C-7100MeGa – Target acquitsition as req’d – 2 targets200 -300mm
PVD Metal Dep: Al , Col Ti & TiN, Uncolimated Ti, Co, NiAMAT Endura HP 4PVD, OD, RF200 mm
PVD Metal Dep: IMP Ti, EnCore Ta, Cu, H2 PrecleanAMAT Endura HP 4PVD, OD, RF200 mm
PVD: Barrier/seed (Ta, Cu, CVD TiN, TiSiN)Novellus Inova 2PVD, MOCVD, OD, RF200 mm
PVD: Barrier/seed (Ta, Cu) w/ Sputter CapabilityNovellus Inova 2PVD, MOCVD, OD, RF300mm
CVD: Undoped PETEOS, O3:TEOS, SiN, SiON, PSG, USG, SiC, Sput EtchbackAMAT Precision 5000 2 TEOS, 1 Pass, 1 EB200 mm
PECVD: Low Temp < 200C, TEOS, SiN, SiloxSTPS APM200 – 300mm
PECVD: SILOX, SiN, SiON, SiCN, SiCo, CORALNovellus Concept Two Sequel200 mm
PECVD: Tungsten DepNovellus Concept One200 mm
ECD: Cu electrodepositionNovellus Sabre Classic200 mm
PECVD – Undoped TEOS CVD & Silane CVD SINASM America Eagle-12 Plasma CVD300 mm
PECVD ILD SILOX, SIN, SION, SICN, SICO, AND CORALNovellus Vector300 mm
Copper PlateNovellus Sabre xT300 mm
ECD: Cu Electrodeposition Damascene and TSV fill capabilityAMAT Raider, (2) 200-300mm Damascene Cells, (2) 200-300mm TSV Cells200 – 300mm
PVD Cu/Ta/TaNNovellus Inova xT Concept 3300 mm
CMP
CapabilityToolWafer Size
CMP: STI oxide, ILD oxide, SiN, W, Cu, Ta/TaN, Si, polyimideAMAT Mirra with Ontrack Scrubber, Titan Head200mm
CMP: STI oxide, ILD oxide, SiN, W, Cu, Ta/TaNAMAT Mirra Mesa, Contour and Profiler Heads200mm
CMP: Cu/Ta/TaN, SiO2AMAT Reflexion CMP-PST System 300mm
Metrology
CapabilityToolWafer Size
Ellipsometer Dielectric Thickness, N & K ValuesJA Woollam VU-301200mm
EOT measurement – Gate MonitorKLA-Tencor Quantox-300 200 – 300mm
Ellipsometry – Film Thk w UV/Deuterium Source w DesorberThermawave OP5240 Opti-Probe200mm
Dark Field Wafer Defect InspectionAMAT Complus200 – 300mm
Four Point Probe contact ResistivityFour Dimensions 300200 – 300mm
Four Point Probe contact ResistivityPrometrix 4PT probe200mm
Defview Review & UV Inspet. scope, (x250)Olympus, FR3200200 – 300mm
Automated Particle Unpat. Surf. Insp. KLA-Tencor SP1200 – 300mm
Automated Particle Unpat. Surf. Insp. KLA-Tencor Surfscan 6420 or 6220200mm
Film Stress & Wafer BowKLA-Tencor Flexus 5400200mm
Film Thickness Measurement- ReflectometryKLA-Tencor UV1050200mm
Texture Measurement – Laser basedVeeco TMS-3000W200 – 300mm
Profiler/Atomic Force Micro. – Tapping Mode with Silicon TipVeeco – Digital Instruments VX310 AFM200 – 300mm
Total Reflect X-Ray Fluor. Spect.TECHNOS (PHILLIPS) TREX630200 – 300mm
Overlay inspection KLA-Tencor 5100-03 Auto Misreg Sys200mm
Overlay inspection KLA-Tencor 6100 Auto Misreg Sys200mm
SEM Top-Down CD, Etch Depth & Profile Angle w TiltAMAT Verity CD-SEM 200 – 300mm
SEM Top-Down CD, Etch Depth & Profile Angle w TiltAMAT VersaSys 3D CD-SEM 200 – 300mm
Overlay inspection. Manual, used with ALN71 or BND toolsEVG EV40-NT OVERLAY TOOL200mm
Metal Film T- Opto-acoustic, AutomatedPhillips Impulse 300B200 – 300mm
X-Ray Refl./X-Ray Flor. Thin Film measurementJordan Valley JVX 5200T XRR/XRF TF Meas200 – 300mm
IR spectroscopy, defect imaging, thick film measurementUnity (Fogale) T-Map200 – 300mm
In-line DC/Small Signal AC testAgilient 4073A/TEL P-12XL (tester)200 – 300mm
CMP
CapabilityToolWafer Size
Automated Wafer Bonding, plasma activation, megasonics cleanEVG Gemini NT +/- .5um O/L, ZiBOND, CuDBI, Silicon Direct Bond150 – 200mm
Bond inspection scanning accoutical microscope 260mHzSonix Echo IV200 – 300mm
Wafer Thinning Silicon and Quartz +/- 1um TTVStrasbaugh 7AF-II w/ insitu thickness measurement200mm
Wafer Edge Trim Silicon and QuartzStrasbaugh 7AB200mm
Manual Bond SystemSuss 5B8e200mm
Automated Bond SystemSuss CBC200200mm