Foundry Technologies

Advanced Integration Technologies

Our niche fuels your innovation.

Vertical device integration for:

  • Drastically increased performance
  • Shorter critical electrical paths
  • Faster operations on smallest possible footprint

Technology Integration Modules


  • Backside high-density Tungsten TSV
  • Typically inserted into backside of foundry wafers
  • Typical CD=0.6-1.2um and aspect ratio 10:1


  • Traditional Cu TSVs with void-free fill
  • Standard TSVs us CD=10um with depth of 100um
    • Wider & deeper TSVs have been demonstrated
    • Custom dimensions are available

C-TSV (Conformal TSV)

  • Conformal fill Cu backside TSV
  • Source wafers thinned to 250um
  • 100um CD tapered TSVs inserted into wafer backside
  • Conformally lined with Cu & filled with polyimide
    • near-planar surface ready for further far-BEOL processing


  • Frontside high-density Tungsten TSV
  • Inserted before or after foundry BEOL layers completed
    • additional BEOL layers (Cu or Al) optional

DBI (Direct Bond Interface)

  • Aligned wafer-to-wafer bonding
  • Enables electrical connection between wafers
    • cross-wafer interconnects at 3um pitch have been demonstrated


  • Low-temperature oxide to oxide bonding
  • Used for 3D integration of source wafers & handle wafers, etc.

MEMS technologies are often developed on four-inch and six-inch silicon wafers. Skorpios Technologies provides advanced development capabilities on a foundry-compatible eight-inch equipment set, allowing more dies per wafer and lower cost per die. The eight-inch silicon platform enables concurrent integration of MEMS technology with CMOS technology.

Skorpios helps accelerate development and commercialization of MEMS technologies, including:

  • Cantilever-based devices
  • Sealed cavity devices
  • Sensors with high-aspect features
  • Devices with unique material requirements and/or low thermal budgets


  • Anodic bonding for glass lid-wafer attach
  • Eutectic metal bonding for hermetic cavities
  • DBI bonding for 3D electrical interconnect

Bosch Etch

  • Industry-leading Bosch-etch capability powered by the latest tools
    • Achieve 25:1 aspect ratios with ease


  • Advanced film support for MEMS devices, with the ability to deposit high-quality films up to 10um thick
  • Full stress-tuning capability for both high-temperature (350C+) and low temp (down to 125C) films

Microfluidics is a key enabling technology for today’s most innovative lab-on-a-chip (LoC) applications, which are revolutionizing the life sciences industry. Microfluidics technology integrates assay operations like detection, sample pre-treatment, and sample preparation on one chip.

Skorpios helps companies accelerate development and commercialization of LoC products. The technology drivers for these products include nano-scale microfluidic channel sizes, smart sensing, and integration with signal processing — all requiring integration with CMOS.

Sacrificial Materials

  • Multiple polyimide processes to help build large fluidic channels and cavities
  • Demonstrated success with the fill of high-aspect cavities using photo-imagable films
    • And the planarization thereof
  • Large cavity formation using sacrificial polyimides
  • Established process modules for thick-film dep, etc. and CMP

Electrode Materials

  • Gold-free, subtractively patterned bio-compatible electrodes (e.g. Platinum)

Transparent Substrates

  • Fully capable FEoL and BEoL process suite for transparent substrates (e.g. quartz)

Nanowires & Nanochannels

  • 193nm (dry) lithography and spacer-based technologies to enable sub-45nm devices

Leverage Skorpios’ Integrated Sensor Platform to bond a sensor wafer to CMOS or take advantage of our diverse materials capability to develop a custom sensor that suits your high precision application.

ESD Protection

  • Proven ability to build ultra-sensitive devices such as PiN diodes through robust ESD protection procedures


  • Bond wafers from different foundries/technologies to create novel devices
  • Novati is fab-agnostic, and works with most major foundries (“split-fab”)

Integrated Sensor Platform

  • Leverage our split-fab manufacturing infrastructure and technology integration modules
  • Custom sensor development and integration

As a critical component of key subsystems in optical network systems, photonic planar lightwave circuits (PLCs) enable superior performance but are challenging and costly to develop and manufacture. By partnering with Skorpios, customers can increase the output of current silicon and quartz-based products, while accelerating the development of new PLC concepts.

Optical waveguide PLC fabrication processes are an extension of CMOS and MEMS processing technology where core lithography, etch, and thin-films technologies apply. Process control of line widths, sidewall roughness, refractive-index uniformity, film thickness, and stress are all key in optimizing device performance.


Most CMOS semiconductor foundries can only handle a small selection of materials. Novati makes novel materials standard. We utilize an Element Review Board (ERB) to enable safe and efficient introduction of any new materials into our facilities.