Novati’s Integrated Sensor Platform Brings It all Together

A few weeks ago, Tezzaron announced its latest industry first: an eight-layer 3D IC wafer stack containing active logic, built at its fab, Novati Technologies, a global nanotechnology development center located in Austin, TX. Novati is clearly on a roll, because today they added another industry first to their product portfolio: an integrated sensor platform that is the culmination of everything Novati does: using all the building blocks in its technology arsenal to create new and unique sensor modules to enable the Internet of Things. Read the full article here.

Skorpios Demonstrates Industry-First 100G System-on-Chip, Fully Integrated Opto-electronics Rx and Tx ICs (S-xoC) at OFC 2015

CWDM4 MSA Releases Detailed Specification for Low Cost 100G Optical Interfaces Targeting Data Center Applications

Skorpios Technologies Joins the Alliance of Data Center, Switching and Optical Transceiver Companies Supporting Standards for 100GBase CLR4

ALBUQUERQUE, N.M. – April 3, 2014 – Skorpios Technologies, Inc., a fabless integrated silicon photonics system-on-a-chip company, today announced that it joined an alliance of companies supporting the 100G CLR4 CWDMspecifications for data center applications.

The 100G CLR4 Alliance was organized by a group of industry leaders, major data center providers, networking companies and optical vendors who are in support of a transceiver based upon 100G CWDM (Coarse Division Multiplexing) LR4 (4 wavelengths) in the 1310nm window and 20nm spacing, hence “CLR4.” Alliance partners believe that this approach will enable the rapid development and adoption of this market segment. Conversely, the lack of low-cost, 100G transceivers may become an impediment to the adoption of advanced CPUs, FLASHSSDs and switching silicon to build the next generation systems for cloud, HPC and enterprise data centers. This Alliance may evolve into an MSA over time.

At the Optical Fiber Communications Conference (OFC 2014) last month, Skorpios announced and demonstrated products based on its proprietary Skorpios Template Assisted Bonding (STAB) process. In particular, Skorpios showcased its industry leading 100G 10km, CLR4 transceiver in a QSFP 28 package together with its leading edge silicon photonics-based micro-ITLA. With these products, Skorpios is delivering on the promise of silicon photonics with the highest-density form factor, lowest-power dissipation and lowest-cost products available in the market.

“Joining this alliance of industry leaders enables quicker adoption of Skorpios’ leading 100G QSFP28 product line,” said Alfredo Viglienzoni, senior vice president of Sales, Marketing and Business Development for Skorpios. “Our novel technology platform allows us to deliver a single product that covers applications from a few hundreds of meters to 10 kilometers. At this point, the technology innovation, which has been the foundation of this company, evolves into product innovation as Skorpios ramps-up production. Our goal has always been to make Skorpios a company known for its innovative technology and highly differentiated products.”

About Skorpios Technologies
Skorpios is a fabless semiconductor company delivering highly integrated communication products based upon our proprietary, wafer-scale, silicon photonics process. This novel process leverages the existing silicon manufacturing ecosystem to enable high-bandwidth interconnectivity at mature CMOS manufacturing costs. Skorpios’ unique platform can be used to address a wide range of applications: high-speed video, data and voice communications for networking and cloud computing, storage, wireless and cable TV. For further information please visit: www.skorpiosinc.com

Skorpios Technologies Demonstrates 100G QSFP28  (100G-QSFP-CLR4)

ALBUQUERQUE, N.M. – March 10, 2014 Skorpios Technologies, Inc., a fabless integrated silicon photonics system on a chip company, today announced the demonstration of a 100G QSFP28 transceiver utilizing Skorpios’ Template Assisted Bonding (STAB) process. In this product, the lasers, modulators, detectors and optical multiplexer/de-multiplexer are monolithically integrated into a single die using the STAB process, providing customers with cost, size and power benefits unachievable with any alternative technologies.

“We are delighted to be demonstrating our QSFP28 at OFC this year,” stated Alfredo Viglienzoni, SVP Sales, Marketing and Business Development. “With our unique integration approach, we can build solutions such as this product, which meet the increasing challenges of bandwidth growth within data centers. This is particularly attractive for those customers who have to operate within fixed infrastructure constraints to minimize capex.”

“The Skorpios QSFP28 underscores our ability to integrate higher level module solutions based on our STAB process. It operates without active cooling, and has a reach of up to 10km, making it ideal for the mega-scale architectures which are emerging to support cutting edge services,” commented Glenn Li, VP Engineering, Enterprise. “This product represents our first step towards multi-Tb/s interconnect bandwidth with small footprint, low power consumption, and low cost. Our high-speed WDMsolutions enable bandwidth increase by better utilizing and without altering the existing cabling structure, thus offering a low- barrier, future-proof upgrade path.”

Skorpios invites customers to meet at the Optical Fiber Communications Conference (OFC) in San Francisco, March 9 – 13th, 2013. Please contact John Trainor (+44 118 973 3444) or Alfredo Viglienzoni (+1 323 823 9760) to arrange further discussions, and schedule a demonstration.

About Skorpios Technologies
Skorpios is a fabless semiconductor company delivering highly integrated communications products based upon our proprietary, wafer-scale, silicon photonics process. This novel process leverages the existing silicon manufacturing ecosystem to enable high bandwidth interconnectivity at mature CMOS manufacturing costs. Skorpios’ unique platform can be used to address a wide range of applications: high-speed video, data and voice communications for networking and cloud computing, storage, wireless and cable TV.

Skorpios Technologies Launches Micro-ITLA Tunable Laser

ALBUQUERQUE, N.M. – March 10, 2014 Skorpios Technologies, Inc., a fabless integrated silicon photonics system on a chip company, today announced the demonstration of a micro-ITLA tunable laser utilizing Skorpios’ Template Assisted Bonding (STAB) process. The laser was designed to meet the stringent demands of next generation high bandwidth coherent 100G transceivers, with linewidths of less than 100 kHz, low optical noise, high power and high stability.

“Launching our micro-ITLA is an important inflection point for Skorpios,” commented John Zyskind, VP Engineering. “Not only have we productized one of the hardest types of laser to develop, but we have initiated production based on our STAB platform, where we integrate a small amount of heterogeneous material using a wafer-scale process within a commercial CMOS fab. This gives us a very attractive cost structure, as well as high reliability because the device is natively hermetic. The Skorpios micro-ITLA will be used as a springboard into more highly integrated devices with a wide range of applications.”

“Using Skorpios’ micro-ITLA, customers are able to deploy coherent modules and transceivers, which have a significantly lower cost and power consumption than are achievable with current technologies,” said Rob Stone, VP of Marketing.

Skorpios invites customers to meet at the Optical Fiber Communications Conference (OFC) in San Francisco, March 9 – 13th, 2013. Please contact John Trainor (+44 118 973 3444) or Alfredo Viglienzoni (+1 323 823 9760) to arrange further discussions, and schedule a demonstration.

About Skorpios Technologies
Skorpios is a fabless semiconductor company delivering highly integrated communications products based upon our proprietary, wafer-scale, silicon photonics process. This novel process leverages the existing silicon manufacturing ecosystem to enable high bandwidth interconnectivity at mature CMOS manufacturing costs. Skorpios’ unique platform can be used to address a wide range of applications: high-speed video, data and voice communications for networking and cloud computing, storage, wireless and cable TV.